Richardson, TX October 3, 2023 – InterFET, a leading provider of high-performance semiconductor components, is pleased to announce the release of its comprehensive JFET SPICE models, accompanied by detailed calculations and equations. These invaluable resources can be accessed in the InterFET CTC-023 and CTC-036 documents, aimed at assisting design engineers in swiftly validating their analog circuit designs.
One of the standout features of InterFET’s JFET SPICE modeling is the callout of the G_{min} values for each JFET geometry. This allows the user to accurately simulate the gate leakage of the JFET. This critical aspect of JFET behavior is addressed using the SPICE command “.options Gm = xxfA”, which enables engineers to account for gate leakage with precision in their simulations. This level of accuracy is indispensable for design engineers looking to ensure the reliability and performance of their analog circuits.
For media inquiries, please contact:
Alan Bennett
[email protected]
(972) 238-9700
About InterFET:
InterFET is a leading provider of high-performance semiconductor components, specializing in JFETs and other precision devices. With a strong commitment to innovation and quality, InterFET serves a diverse range of industries, including aerospace, medical, industrial, and telecommunications.
Note to editors:
For additional information or interview requests, please contact Alan Bennett at (469) 663-9116 or [email protected]. High-resolution images and further details about InterFET are available upon request.