InterFET Corporation introduced the industry standard IF1320 in a Matched Dual configuration to fill in its portfolio of over 500 standard JFETs. The IF1322 is a dual die matched pairs in a single plastic surface mount package. Most of the JFET industry produces monolithic dual JFETs on a single substrate, but InterFET uses the dual die approach to reduce cross talk from the parasitic transistor created in the substrate between the gates of the monolithic devices. InterFET matches adjacent die to stringent electrical characteristics to eliminate the parasitic transistor as a source of noise and only uses adjacent die to best improve the match. The IF1322 is based on our very low noise NJ132L geometry that has been in production for over 30 years. By matching two adjacent NJ132 die to create this new device, InterFET enables design engineers to utilize the high sensitivity and stability to create a high performing differential sensor input or a constant current supply.
InterFET’s IF1322 product offering can be used as a cross for Toshiba’s 2SK389 parts as well as Linear Systems LSK389x products.
