High Reliability & JAN Process Flow

InterFET Corporation has supported the military and industry with high-reliability junction field-effect transistors (JFET) since our founding. We offer processing services tailored to customer source control drawings and detailed specifications.

InterFET produces devices that meet the requirements of MIL-PRF-19500 and MIL-STD-750 from JAN through full JANS-level processing. Certifications for these products are available through our qualified partners. For customers requiring strict traceability and consistency, we also offer manufacturing baseline control as an option.

Recognized for our consistent performance and trusted by military and industrial clients alike, InterFET is proud to deliver high-reliability solutions for mission-critical applications.

We offer a range of standard high-reliability processing options for most packaged JFETs and die only solutions. These standard processes are often more cost-effective than those tied to custom source control drawings while still delivering excellent performance.

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Our Key Features

  • InterFET’s epitaxial JFET fabrication process is inherently radiation tolerant. We enhance this
    further with optimized die geometries designed for superior epitaxial isolation, resulting in improved radiation hardness.
  • We offer specialized packaging solutions tailored to meet virtually any customer requirement, ensuring mechanical and environmental compatibility for demanding applications.
  • Our customization capabilities include bare die products available in a variety of formats — including waffle packs, unsawn wafers, and bumped die — to support diverse assembly and integration needs.
  • InterFET provides flexible up screening services; customers can request full JAN process flows or select only those requirements their applications require. 
Designer (1)

Process Flow for our JFET Parts

Option 1 Process Flow Evaluation for High Reliability Unencapsulated JFET Die

Screen MIL-STD Method Condition
Pre-Cap Visual 750-2072 100% @ 100x minimum Per InterFET 70007
Seal Per InterFET 28017
Initial Electrical Per InterFET 70022
Temperature Cycle 750-1051 Condition D, 20 cycles, -65 degree to +200 degree Celsius, 15 mins at extremes, minimum
Final Electrical Per InterFET 70002
Wire Bond Evaluation 889-2011 Per InterFET 19506

Option 2 Process Flow for JAN Equivalent JFET

Screen MIL-STD Method Condition
Pre-Cap Visual 750-2072 100% @ 100x minimum Per InterFET 70007
Seal Per InterFET 28017
Initial Electrical Per InterFET 70022
Temperature Cycle 750-1051 Condition D, 20 cycles, -65 degree to +200 degree Celsius, 15 mins at extremes, minimum
Constant Acceleration 750-2006 Y1 axis only, 20,000g
Fine Leak 750-1071 Condition G or H, 5E-8 atm/cc-sec maximum
Gross Leak 750-1071 Condition C
Pre-HTRB Electrical Per InterFET 70023
HTRB-Conditioning 750-1039 Condition A, 150 degree Celsius for 168 hours, minimum
Post-HTRB End Point Electrical Per InterFET 70002 within 24 hours
Final Electrical Per InterFET 70002 Optional if all customers required electrical parameters are included in Post-HTRB test
Quality Conformance Per InterFET 19506

Option 3 Process Flow for JAN Equivalent JFETs in Metal Case

Screen MIL-STD Method Condition
Pre-Cap Visual 750-2072 100% @ 100x minimum Per InterFET 70007
Seal Per InterFET 28017
Initial Electrical Per InterFET 70022
Stability Bake 750-1031 200 Degree Celsius for 24 hours
Temperature Cycle 750-1051 Condition D, 20 cycles, -65 degree to +200 degree Celsius, 15 mins at extremes, minimum
Constant Acceleration 750-2006 Y1 axis only, 20,000g
PIND 883-2020 Condition A
Fine Leak 750-1071 Condition G or H, 5E-8 atm/cc-sec max
Gross Leak 750-1071 Condition C
Pre-HTRB Electrical Per InterFET 70023
HTRB-Conditioning 750-1039 Condition A, 150 degree Celsius for 168 hours, minimum
Post-HTRB End Point Electrical Per InterFET 70002 within 24 hours
Radiography 750-2076 X1 & Y1 Directions
External Visual 750-2071
Final Electrical Per InterFET 70002 Optional if all customers required electrical parameters are included in Post-HTRB test
Quality Conformance Per InterFET 19506

Contact our sales team for high reliability in plastic packaging.