High Reliability & JAN Process Flow
InterFET Corporation has supported the military and industry with high-reliability junction field-effect transistors (JFET) since our founding. We offer processing services tailored to customer source control drawings and detailed specifications.
InterFET produces devices that meet the requirements of MIL-PRF-19500 and MIL-STD-750 from JAN through full JANS-level processing. Certifications for these products are available through our qualified partners. For customers requiring strict traceability and consistency, we also offer manufacturing baseline control as an option.
Recognized for our consistent performance and trusted by military and industrial clients alike, InterFET is proud to deliver high-reliability solutions for mission-critical applications.
We offer a range of standard high-reliability processing options for most packaged JFETs and die only solutions. These standard processes are often more cost-effective than those tied to custom source control drawings while still delivering excellent performance.
Our Key Features
- InterFET’s epitaxial JFET fabrication process is inherently radiation tolerant. We enhance this
further with optimized die geometries designed for superior epitaxial isolation, resulting in improved radiation hardness.
- We offer specialized packaging solutions tailored to meet virtually any customer requirement, ensuring mechanical and environmental compatibility for demanding applications.
- Our customization capabilities include bare die products available in a variety of formats — including waffle packs, unsawn wafers, and bumped die — to support diverse assembly and integration needs.
- InterFET provides flexible up screening services; customers can request full JAN process flows or select only those requirements their applications require.
Process Flow for our JFET Parts
Option 1 Process Flow Evaluation for High Reliability Unencapsulated JFET Die
| Screen | MIL-STD Method | Condition |
|---|---|---|
| Pre-Cap Visual | 750-2072 | 100% @ 100x minimum Per InterFET 70007 |
| Seal | Per InterFET 28017 | |
| Initial Electrical | Per InterFET 70022 | |
| Temperature Cycle | 750-1051 | Condition D, 20 cycles, -65 degree to +200 degree Celsius, 15 mins at extremes, minimum |
| Final Electrical | Per InterFET 70002 | |
| Wire Bond Evaluation | 889-2011 | Per InterFET 19506 |
Option 2 Process Flow for JAN Equivalent JFET
| Screen | MIL-STD Method | Condition |
|---|---|---|
| Pre-Cap Visual | 750-2072 | 100% @ 100x minimum Per InterFET 70007 |
| Seal | Per InterFET 28017 | |
| Initial Electrical | Per InterFET 70022 | |
| Temperature Cycle | 750-1051 | Condition D, 20 cycles, -65 degree to +200 degree Celsius, 15 mins at extremes, minimum |
| Constant Acceleration | 750-2006 | Y1 axis only, 20,000g |
| Fine Leak | 750-1071 | Condition G or H, 5E-8 atm/cc-sec maximum |
| Gross Leak | 750-1071 | Condition C |
| Pre-HTRB Electrical | Per InterFET 70023 | |
| HTRB-Conditioning | 750-1039 | Condition A, 150 degree Celsius for 168 hours, minimum |
| Post-HTRB End Point Electrical | Per InterFET 70002 within 24 hours | |
| Final Electrical | Per InterFET 70002 Optional if all customers required electrical parameters are included in Post-HTRB test | |
| Quality Conformance | Per InterFET 19506 |
Option 3 Process Flow for JAN Equivalent JFETs in Metal Case
| Screen | MIL-STD Method | Condition |
|---|---|---|
| Pre-Cap Visual | 750-2072 | 100% @ 100x minimum Per InterFET 70007 |
| Seal | Per InterFET 28017 | |
| Initial Electrical | Per InterFET 70022 | |
| Stability Bake | 750-1031 | 200 Degree Celsius for 24 hours |
| Temperature Cycle | 750-1051 | Condition D, 20 cycles, -65 degree to +200 degree Celsius, 15 mins at extremes, minimum |
| Constant Acceleration | 750-2006 | Y1 axis only, 20,000g |
| PIND | 883-2020 | Condition A |
| Fine Leak | 750-1071 | Condition G or H, 5E-8 atm/cc-sec max |
| Gross Leak | 750-1071 | Condition C |
| Pre-HTRB Electrical | Per InterFET 70023 | |
| HTRB-Conditioning | 750-1039 | Condition A, 150 degree Celsius for 168 hours, minimum |
| Post-HTRB End Point Electrical | Per InterFET 70002 within 24 hours | |
| Radiography | 750-2076 | X1 & Y1 Directions |
| External Visual | 750-2071 | |
| Final Electrical | Per InterFET 70002 Optional if all customers required electrical parameters are included in Post-HTRB test | |
| Quality Conformance | Per InterFET 19506 |
Contact our sales team for high reliability in plastic packaging.