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  • InterFET CEO Dan Roberts Hopes to Use Industrial Advisory Board Position to Encourage Engineering Students to Increase Their Knowledge of Analog and Mixed-Signal Technologies  ...More

  • In an article entitled “JFET Applications in Today’s Analog World”, InterFET Vice President of Engineering Don Schuyler describes how JFETs still fill a critical need in the signal chain.  ...More

  • A new N-channel JFET with high gain JFET with integrated back-to-back diodes. Designated the IFND89, it is packaged in the 5-leaded SC70 package,  ...More

  • As Vishay/Siliconix quietly exits the JFET business, rest assured that your JFET requirements are still in good hands with InterFET.  ...More

  • 25 years have come and gone since we opened our doors in 1982, a business spun off from Texas Instruments when they elected to exit  ...More

    

       Note : The InterFET U.S. facilities and processes have been audited to current MIL-Q-45208 quality standards.
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InterFET RoHS Compliance

  

The standard device symbolization will be underlined to designate RoHS compliant product.
 
 
Metal Case is RoHS compliant
The following packages are and have always been lead free/RoHS compliant:
        • Bare die/wafer
        • Metal Case
        • TO18
        • TO39
        • TO46
        • TO52
        • TO71
        • TO72
        • TO78
        • TO99

Other RoHS-compliant plastic package facts:
Plating material 100% matte tin
Lead frame material Copper 194 or Alloy 42
Lead content of
plating material
  Lead free
(ie, less than .1%, 1000ppm by weight)
Soldering  Maximum Temperature=260 Degree C
 Maximum Time=20-40 seconds
Reflow Profile  Peak Temperature=260 Degree C,
 Peak Time=20-40 seconds 
Acceptable Reflows 3 reflows
Backward
Compatibility
Lead Free packages can be soldered using 
existing Sn-Pb solder and temperature profiles 
Foward 
Compatibility
Lead Free Packages can be soldered using lead  free
solders and the appropriate higher temperature profiles

 

Historically, in an effort to satisfy our diverse customer base, InterFET has supplied both leaded and non-leaded (RoHS compliant) SOT-23 packages. Our standard package has continued to be the leaded version, although many customers have already been specifying “ROHS compliance required”, and that is what we have been shipping to them. Most major semiconductor suppliers made the conversion to 100% RoHS compliance over the past several years, and today, the availability of leaded lead frames continues to decline, with RoHS having become the industry standard. Therefore, effective July 1, 2010, InterFET will begin shipping 100% RoHS compliant SOT-23 packages. (Note that today 100% of our TO-92 and SOIC-8 packages are already RoHS compliant.) Leads will be matte tin, with no lead content. We do not anticipate any significant issues for our customers, as the vast majority have made this conversion already.

In some cases, InterFET will have existing inventory of leaded parts beyond the July 1 cutover, and we will deplete this inventory prior to making the change for those specific devices.