Note :
The InterFET U.S. facilities and processes have been audited to current MIL-Q-45208 quality standards.
InterFET RoHS Compliance
The standard device symbolization will be underlined to designate RoHS compliant product.
Metal Case is RoHS compliant
The following packages are and have always been lead free/RoHS compliant:
-
Bare die/wafer
-
Metal Case
-
TO18
-
TO39
-
TO46
-
TO52
-
TO71
-
TO72
-
TO78
-
TO99
| Other RoHS-compliant plastic package facts: |
| Plating material |
100% matte tin |
| Lead frame material |
Copper 194 or Alloy 42 |
Lead content of
plating material |
Lead free
(ie, less than .1%, 1000ppm by weight) |
| Soldering |
Maximum Temperature=260 Degree C
Maximum Time=20-40 seconds |
| Reflow Profile |
Peak Temperature=260 Degree C,
Peak Time=20-40 seconds |
| Acceptable Reflows |
3 reflows |
Backward
Compatibility |
Lead Free packages can be soldered using
existing Sn-Pb solder and temperature profiles |
Foward
Compatibility |
Lead Free Packages can be soldered using lead free
solders and the appropriate higher temperature profiles |
Historically, in an effort to satisfy our diverse customer base, InterFET has supplied both leaded and non-leaded (RoHS compliant) SOT-23 packages. Our standard package has continued to be the leaded version, although many customers have already been specifying “ROHS compliance required”, and that is what we have been shipping to them. Most major semiconductor suppliers made the conversion to 100% RoHS compliance over the past several years, and today, the availability of leaded lead frames continues to decline, with RoHS having become the industry standard. Therefore, effective July 1, 2010, InterFET will begin shipping 100% RoHS compliant SOT-23 packages. (Note that today 100% of our TO-92 and SOIC-8 packages are already RoHS compliant.) Leads will be matte tin, with no lead content. We do not anticipate any significant issues for our customers, as the vast majority have made this conversion already.
In some cases, InterFET will have existing inventory of leaded parts beyond the July 1 cutover, and we will deplete this inventory prior to making the change for those specific devices.